| 摘要 |
<p>PURPOSE:To mount/dismount a microcomputor freely by mounting a microcomputor and associated circuit elements producing no heat on a wiring board and encapsulating circuit elements, mounted on a substrate and producing heat, and other circuit elements in a sealed space defined by the substrate and a casing member. CONSTITUTION:Power circuit elements 4 producing heat are mainly mounted on a substrate 2 superposed by a wiring board 8 and a plurality of circuit elements such as chip capacitors are mounted substantially on the entire area of the substrate 2, while furthermore a microcomputor 7 and associated circuit elements 4 are mounted on the wiring board 8. A hole 5 is made at a desired position of a casing member 6, and the wiring board 8 mounting the microcomputor 7 and a plurality of associated circuit elements 4 is disposed and accommodated in a space defined by the hole 4 and connected with conducting paths 3 formed on the substrate 2. By such arrangement, the microcomputor 7 having desired control features can be mounted/dismounted freely under a state where the circuit elements 4 mounted on the substrate 2 are sealed hermetically against the casing member 6.</p> |
