| 摘要 |
1,217,148. Circuit assemblies. NATIONAL RESEARCH DEVELOPMENT CORP. 10 Oct., 1968 [13 July, 1967], No. 32347/67. Heading H1R. Heat dissipating microelectronic components or devices are mounted on a substrate comprising a layer of high thermally conductive material provided with projections and covered with a layer of electrically insulating material. A copper sheet is pressed with a die to produce a plurality of conical projections at positions where the components are to be mounted. The layer is then coated with a glass slurry 5 and fired, the portions of the projections extending from the layer 5 being removed to leave the bare flat surface portions 4 of the projections. The components are mounted thereon and interconnections provided on the surface of insulating material 5. In a second embodiment, Fig. 3 (not shown), a further layer of electrically insulating material is positioned over layer 5 and portions 4. |
