| 摘要 |
<p>In a bipolar semiconductor-on-insulator transistor device (1) comprising an emitter region (4), a base region (5), a collector region (2) and a collector contacting region (6) in a semiconductor wafer, e.g. a monocrystalline silicon wafer (2), on top of an insulator (3), the base-emitter and collector-base junctions are tilted relative to the interface between the semiconductor wafer (2) and the insulator (3). The device can be made by anisotropic etching in order to produce a tilted surface (7) at an edge of the device or equivalently a V-groove having tilted sidewalls. The base and emitter regions (5, 4) are then produced by diffusing suitable donor and acceptor atoms into the material inside the tilted surface. Such a bipolar semiconductor-on-insulator transistor combines the high speed features of a lateral semiconductor device and the high voltage features of a vertical semiconductor device.</p> |
