| 摘要 |
<p>PURPOSE:To heighten the adhesion strength of copper to resin and its acid resistance by a method in which when copper is stuck to resin, the process forming a copper oxide-layer on the surface of copper and the process reducing the formed copper oxide-layer to metallic copper by the acid reducing solution with at most a specified value of E16 A, are used. CONSTITUTION:When copper is stuck to resin, after the copper oxide layer formed on the surface of the copper has been reduced to metallic copper by the acid reducing solution with at most 7.0 of E 16 A, if they are pressure bonded under heating, excellent acid resistance and adhesion strength may be obtained. Since acid reducing solution is used, the water cleaning effect after dipping is excellent, and its fatty layer is not deteriorated. As the copper oxide layer-forming method, the water solution containing oxidizing agent is preferably used. In order to reduce the formed copper oxide layer to metal, the acid solution in which at least one kind in amine boran group shown by the general formula of BH3.NHRR'(R,R':H, CH3, CH2, CH3) is mixed with the chemical of boron group, is preferably used.</p> |
