| 摘要 |
A cooling device located between a cooling plate having a first coolant circulating therein, and an electronic part to be cooled, mounted on a printed-wiring board, comprising a hollow part being thermally conductive, having a hollow chamber through which the first coolant circulates, and connected to the cooling plate by a flange part being thermally conductive, a thermal conduction plate attached to a surface of the electronic part and connected to the flange part by a bellows providing a space among the hollow part, the bellows and the thermal conduction plate, and a second liquid coolant filling the space for transferring heat from the thermal conduction plate to the hollow part by a convection current of the second coolant. The second coolant is made of alloy being chemically inactive to the bellows and having a low melting point so as to be liquid at ordinary temperatures. |
