SOLDER LAND FOR CHIP COMPONENT,申请号JP19900036868-传众专利搜索

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发明名称	SOLDER LAND FOR CHIP COMPONENT
摘要
申请公布号	JPH03239393(A)	申请公布日期	1991.10.24
申请号	JP19900036868	申请日期	1990.02.17
申请人	TAMURA SEISAKUSHO CO LTD	发明人	ABE YOSHINOBU
分类号	H05K3/34;H05K1/11	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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