| 摘要 |
<p>Composite dielectric materials are provided having exceptional thermal stability of dielectric constant and low matrix coefficient of thermal expansion. These materials comprise fabrics (12), either woven or nonwoven, impregnated with filled (16) thermosetting resins (14). Also provided is a method of manufacture of these dielectric materials. The dielectric materials are useful in single layer and multilayer printed circuit boards.</p> |
