发明名称 Activation bath for electroless nickel plating
摘要 In a process for the electroless plating of nickel onto a substrate made of aluminum or an aluminum alloy, an aqueous acidic solution containing as an essential component a palladium salt is used as an activator of the substrate prior to the nickel plating of the substrate. The activating solution contains a palladium salt, an alkali metal fluoride or hydrofluoric acid, a carboxylic acid complexing agent, an alkali metal salt of gluconic acid, an iron salt, a nickel salt, and deionized water.
申请公布号 US5753304(A) 申请公布日期 1998.05.19
申请号 US19970880281 申请日期 1997.06.23
申请人 THE METAL ARTS COMPANY, INC. 发明人 TUNG, WEILY
分类号 C23C18/30;(IPC1-7):B05D3/04;C23C3/02 主分类号 C23C18/30
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