| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin exterior packaged semiconductor device in which the deterioration of high frequency performance of a loaded semiconductor element can be prevented without complicating the structure of a resin exterior packaged body. SOLUTION: Solid paraffin wax which is a solid at normal temperature is heated and melted and applied to the electrode part of a semiconductor element chip 5 so that a paraffin wax layer 11 can be formed in a part where a hollow part should be formed. Next, the paraffin wax layer 11 and the semiconductor element chip 5 are covered with exterior packaged resin. Then, the packaged resin is heated and hardened so that a resin packaged body 7 can be formed, and the paraffin wax layer 11 is melted by the heat, and allowed to permeate in the resin packaged body 7 so that a hollow part 8 can be formed. Finally, the resin packaged body 7 is heated to a prescribed temperature, and the paraffin wax remaining in the hollow part 8 as remainder is volatilized. |
