| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to increase the number of wiring patterns at low cost, by printing a carbon wiring pattern to be connected with terminals of a microcomputer and a liquid crystal display on an insulating film formed on a wiring pattern formation region. SOLUTION: First of all, a wiring pattern 12 constituted of a copper foil is formed on one face of an insulating substrate 11. Then, an insulating film 13 is formed on a region where the wiring pattern 12 is formed and a carbon wiring pattern 14 to be connected with terminals of a microcomputer and a liquid crystal display is printed on the insulating film 13. In this case, the insulating film 13 is formed except for sections for connecting the wiring pattern 12, and the carbon wiring pattern 14 or the insulating film 13 is formed over the entire region and, after that, parts of the insulating film 13 are removed to open holes for connecting the wiring pattern 12 and the carbon wiring pattern 14. By this method, a multilayer interconnection can be formed on one face of the insulating substrate 11, thereby increasing a wiring space and obtaining a low-cost printed wiring board. |
