| 摘要 |
PROBLEM TO BE SOLVED: To improve efficiency in cleaning for the inside of a microscopic holes formed on a substrate, with respect to a substrate dry cleaning apparatus using an excimer lamp. SOLUTION: Ultraviolet-rays irradiated from an excimer lamp unit 30 are reflected by a reflector 32 into a beam, almost in parallel with the axis of minute-diameter hole formed on the substrate 14 and are irradiated on the substrate 14 mounted in a treatment chamber 12. As a result, the irradiation of the ultraviolet rays can surely reach the depth of minute-diameter hole, so the ultraviolet rays are irradiated to the substrate 14 and the inside of the microscopic diameter hole of the substrate 14. By using the cleaning gas fed to the treatment chamber 12 and the ultraviolet rays, the residue (organic matter on the surface and inside the microscopic diameter hole of the substrate 14 can be removed reactively.
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