| 摘要 |
PROBLEM TO BE SOLVED: To provide a small and light-weight envelope of an electronic circuit device, without degrading heat sink mass performance for a power semiconductor element and heat-radiation performance for a cooling member. SOLUTION: A case 1 comprises a bottom plate part 11 where an outside bottom surface contacts a cooling member 2, a side wall 12 provided upright around the bottom plate part 11, and a stage part 13 where, protruding from the bottom plate part 1 to a level lower than the side wall 12, a power semiconductor element 3 is placed. The stage 13 is so formed as to contact the side wall 12. Thus, a heat-transfer resistance and a heat sink mass required for the stage 13 are reduced, for smaller and light-weight envelope 1.
|
