RESIST RESIDUES REMOVING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a resist residues removing method without deterioration of a semiconductor device as recesses on the layer insulation films, spread connection holes or roughed wirings, etc. SOLUTION: A process sequence involving a peeling liquid process using a fluoric peeling liquid for a process time so shortened as not deteriorating a semiconductor device is repeated at least twice.