| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin film magnetic head corresponding to high density recording and shortening of a cutting allowance, and an wafer structure. SOLUTION: A circuit outgoing line 22b constituting an electric circuit 20 and an element outgoing line 4a constituting a thin film magnetic head element 10 are electrically connected with an electric conductive film 16, and an element bump 7 is shared by the electric circuit 20 and the thin film magnetic head 10. And the monitoring of the information from the electric circuit 20 through the element bump 7 is electrically carried out through a bonding pad 18 electrically connected with this element bump 7. |
