| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding tool for electronic parts which suppresses generation of bending vibration in a vertical direction and does not damage the quality of electronic parts. SOLUTION: In a bonding device for the electronic parts crimps on a board by applying vibration while pressing on by means of the bonding tool, mounting eyes 15 a which fix the bonding tool 14 are provided on a block 13 rising and falling vertically against the board, at the position corresponding to a loop of a standing wave of the vibration of a horn 15, and the mounting eyes 15a are designed to connect with a main body portion of the horn 15 by a connecting portion A which has a thin-walled section and a notch B vertically symmetric. As a result, bending rigidity of the section of connecting portion A can be smaller, transmission of the vibration by bending excited in a fixing portion to the main body of the horn is suppressed and the generation of displacement in the vertical direction owing to the vibration by bending of the horn 15 can be suppressed.
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