发明名称 SENSOR WITH MOLDED SENSOR DIAPHRAGM COVER
摘要 <p>A diaphragm cover apparatus and method for a sensor are disclosed. A sensor cover is located proximate to a base. A dimple can be located centrally within the cover, wherein the dimple comprises a component that is separate from the sensor cover and diaphragm. The dimple contacts a sense element of the sensor. Additionally, a foil can be adapted for use in blocking air permeation through the sensor diaphragm, when the sensor experiences pressure. An over mold diaphragm is generally located as part of the sensor cover. The dimple itself comprises a highly polished surface to reduce stress concentrators from contacting the sense element. The dimple can be formed from materials such as stainless steel, ceramic and the like to optimize the performance of the sensor.</p>
申请公布号 WO2005017479(A1) 申请公布日期 2005.02.24
申请号 WO2004US25266 申请日期 2004.08.05
申请人 HONEYWELL INTERNATIONAL INC.;GALL, KENNETH, E. 发明人 GALL, KENNETH, E.
分类号 B60C23/04;G01L7/08;G01L9/00;(IPC1-7):G01L7/08;G01L17/00 主分类号 B60C23/04
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