发明名称 Adhesive and electric device
摘要 <p>A novel adhesive cures quickly at a lower temperature and ensures reliable connection of objects the adhesive connects with each other. The adhesive includes a metal chelate, a silane coupling agent and a thermosetting resin. The silane coupling agent in the adhesive is hydrolyzed at its alkoxy groups to form silanol groups, which in turn react with the metal chelate to produce cations in the adhesive. The resulting cations cause the epoxy resin as a thermosetting resin, to undergo cationic polymerization. The adhesive of the present invention cures at a lower temperature by taking advantage of the cationic polymerization.</p>
申请公布号 HK1049183(A1) 申请公布日期 2006.09.01
申请号 HK20030101346 申请日期 2003.02.21
申请人 SONY CHEMICALS CORP. 发明人 TAKAYUKI MATSUSHIMA
分类号 C09J11/02;C08K5/5415;C08L63/00;C09J5/06;C09J7/00;C09J11/06;C09J163/00;C09J201/00;H01L21/56;H01L21/60;(IPC1-7):C09J 主分类号 C09J11/02
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