发明名称 Fabrication method of semiconductor device
摘要 A fabrication method of a semiconductor device includes steps of performing any one of O<SUB>2 </SUB>ashing, organic processing, and dry etching on a surface of a GaN-based semiconductor layer, etching the surface of the GaN-based semiconductor layer in a mixed solution of acid and an oxidizing agent, and forming an electrode on the surface of the GaN-based semiconductor layer.
申请公布号 US2006223326(A1) 申请公布日期 2006.10.05
申请号 US20060390105 申请日期 2006.03.28
申请人 EUDYNA DEVICES INC. 发明人 NISHI MASAHIRO
分类号 H01L21/306 主分类号 H01L21/306
代理机构 代理人
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