发明名称 Heat dissipating structure for mobile device
摘要 Embodiments of a heat dissipating structure and method for a mobile device can cool components of a mobile terminal. The heat-dissipating structure can include a case, a device mounted in the case that generates heat in connection with its operation, and a cooling unit. The cooling unit can include a housing having a refrigerant therein, a first heat exchanging part for absorbing the heat through a thermal contact with the device and a second heat exchanging part for dissipating the heat.
申请公布号 US7188484(B2) 申请公布日期 2007.03.13
申请号 US20040786308 申请日期 2004.02.26
申请人 LG ELECTRONICS INC. 发明人 KIM YE-YONG
分类号 F25D23/12;F25D17/02;G06F1/20;H05K7/20 主分类号 F25D23/12
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