MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND MOUNTING METHOD THEREOF, AND OPTICAL COMMUNICATION MODULE

摘要

PROBLEM TO BE SOLVED: To more stably mount an electronic component on a substrate by an adhesive member.SOLUTION: A surface emitting laser 21 is fixed on each through hole 20c of a first face 20a by an adhesive BD supplied to a first face 20a side via each through hole 20c from a second face 20b side. Thus, the supply amount of the adhesive BD supplied to the first face 20a can be easily controlled to a minute amount of minimum requirements, so that the surface emitting laser 21 can be mounted stably on a substrate 20 by the adhesive BD.SELECTED DRAWING: Figure 4