PRESSURE-WELDING TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the reliability of a pressure-welding type semiconductor device stack without increasing costs.SOLUTION: A pressure-welding type semiconductor device includes: a semiconductor 10; a liquid cooling type heat sink 3 which contacts with the semiconductor 10 to cool the semiconductor 10; and a heat insulation material 2 provided on a surface of the heat sink 3 which contacts with outer air.SELECTED DRAWING: Figure 1