| 摘要 |
The present invention relates to an electric component, a semiconductor package, and an electronic device using the same. The electronic component comprises: an electronic element; an encapsulant which encapsulates the electronic element, and includes a first surface and a second surface which are parallel to each other; and a lead which is electronically connected to the electronic element, and is extended from the electronic element to the outside of the encapsulant. The lead is included between a flat side of the first surface and a flat side of the second surface. When the electronic component and/or the semiconductor package are used, a significantly thin electronic device having excellent performance can be manufactured. |
