CHIP COMPRISING DEFORMATION COMPENSATION LAYERS

摘要

A chip (100) comprising at least: - a first substrate (102); - a first electronic and/or mechanical circuit (108) arranged in and/or on a front face (104) of the first substrate; - a first deformation compensation layer (120) suitable for compensating a deformation of the chip at room temperature; - a second deformation compensation layer (124) suitable for compensating a deformation of the chip between the room temperature and a first temperature which is higher than the room temperature; and wherein the first and second deformation compensation layers are stacked on a rear face (106) of the first substrate.