MULTI-CHIP PACKAGE USING PCB

摘要

A multi chip package using a printed circuit board(PCB) that multi-layer wiring patterns are connected to a heat sink via thermal vias and electrically connected to a bonding pad region via through holes. The package uses a PCB made by the steps of: mounting and wire-bonding more than one tested bare chips on the bonding pad region that is formed on top of the PCB, molding the bonded bare chips with plastic to protect the chips from external environment, and connecting electrode pads put around the outermost of the PCB with clip-shaped lead connectors to mount the main PCB to a lead frame.