Semiconductor package with improved conduction cooling structure

摘要

A semiconductor device package having a substrate, one or more semiconductor devices mounted on the top surface of the substrate, a heat sink having a surface in opposed spaced parallel relation to the top surface of the substrate, and at least one deformable heat transfer member positioned between a device mounted on the top surface of the substrate, and the surface of the heat sink. The heat transfer member is comprised of a porous block of material, and a heat conductive non-volatile liquid retained within the block of material by a surface tension. The heat transfer member being operative to transfer heat from the device to the heat sink.