发明名称 PRELIMINARY SOLDERING METHOD
摘要 PURPOSE:To perform easily preliminary soldering without using any flux by pressing a solder member directly onto the conductor surface to be subjected to preliminary soldering and melting the solder member by the heat generated by the contact electrical resistance between both. CONSTITUTION:One electrode terminal 3b of a pulse current power source 3 is connected to one end of a lead conductor 1 to be subjected to preliminary soldering. The other electrode terminal 3a is electrically connected by means of a clip, etc. to a bar-shaped solder member 2 consisting of a low melting alloy. The member 2 is pressed to the prescribed part of the conductor 1 while the conductor 1 is kept placed on, for example, an insulating support base 4, then the contact surfaces are slided. Prescribed pulse current is conducted between both at the timing thereof and the contact part of the member 2 is melted by the Joule heat generated locally by the contact resistance between both. The prescribed part of the conductor 1 is thus easily soldered preliminarily without using flux.
申请公布号 JPS59137174(A) 申请公布日期 1984.08.07
申请号 JP19830010916 申请日期 1983.01.25
申请人 FUJITSU KK 发明人 KAWACHI TETSUYA
分类号 B23K1/20;B23K3/04;H05K3/34 主分类号 B23K1/20
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