发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE, LEAD FRAME USED THEREIN AND MANUFACTURE OF LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To reduce unit manufacturing cost by providing an unsharp rouge surface at the resin flow path region or a part or the whole of the path and another region, and performing sealing thereafter. SOLUTION: A sattin finished rough surface 21 is formed on the bottom surface (rear surface) of a lead frame 10. The surface 21 is provided on the surface of a resin flow path region 23 where resin flows, connected to a seal region 22 where a seal member (package) is formed by the resin. The sattin finished surface 21 is formed such that a projecting portion 26 has a rounded tip and a recess portion has a rounded bottom, thus the surface 21 has an unsharp rough finish. Thus, when an external force for removal is applied to the resin portion, the lead frame 10 and the resin easily slide with each other at slopes of the recess and projection portions, and the resin can be easily removed from the lead frame 10.
申请公布号 JPH09321205(A) 申请公布日期 1997.12.12
申请号 JP19960134971 申请日期 1996.05.29
申请人 HITACHI LTD;AKITA DENSHI KK 发明人 SASAMURA SATOSHI
分类号 H01L21/56;H01L23/50 主分类号 H01L21/56
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