| 摘要 |
PURPOSE:To reduce the deterioration of characteristics due to a plating layer, by forming a plating layer on an outer lead part, after plating-resistant coating material is formed on a clad layer on the surface of a positioning member. CONSTITUTION:After plating-resistant coating material 7B is formed on the surface of positioning parts 5B, 5C, a plating layer 11 is formed on an outer lead part 5E. The plating layer 11 is not formed on the surface of the positioning parts 5B, 5C. Therefore, the attaching of foreign matter to the light receiving surface of a solid-state image sensing element chip 3 is reduced, which foreign matter is generated by the exfoliating of a plated layer 11 formed on the surfaces of the positioning parts 5B, 5C during the forming process of the solid-state image sensing device 1. As a result, the deterioration of characteristics of the solid-state image sensing device 1 is prevented. Further manufacturing process can be reduced, by forming the plating-resistant coating material 7B in the same manufacturing process as an insulative coating material 7A. |
