| 摘要 |
PURPOSE:To realize a highly reliable miniaturized IC packaging structure which is thin in thickness without increasing the cost by performing ball bonding to a pattern on a circuit substrate as the first bonding and, at the same time, non-ball bonding to a pad electrode on an IC chip as the second bonding. CONSTITUTION:After a connecting lead 6 is connected to a pattern 4 by ball bonding which is performed as the first bonding, the lead 6 is connected to a pad electrode of a chip by stitch bonding which is performed as the second bonding. With the chip mounted, the loop height of the connecting lead from the pattern 4 is 400mum in maximum by taking the deviation into account, and the distance between the first bond and the second bond becomes less than 500mum. |
