| 摘要 |
PURPOSE:To decrease the area of a part to which a bonding wire is crimped, e.g. the area of a pad on a semiconductor chip. CONSTITUTION:With bonding tools 2a and 2b closed and with the vicinity of the tip of a metal thin wire 1 bitten by the tips of chucks 3a and 3b, the metal thin wire 1 is held. In this condition, first bonding is performed with the tip of the metal thin wire 1 pressed on the to a pad 9 of a semiconductor chip 8 by the bonding tools 2a and 2b. After this, the bonding tools 2a and 2b are opened, and the tips of the chucks 3a and 3b are drawn from the metal thin wire 1, and the grasp of the metal thin wire 1 is released. In this condition, looping of the metal thin wire 1 and second bonding to a lead 10 are performed by the bonding tools 2a and 2b. Accordingly, it becomes possible to reduce the size of the semiconductor chip 8 by the decrease of the area of the pad 9, since a large ball or squeeze is not needed at the tip of the metal thin wire 1 at the time of the first bonding. |
