| 摘要 |
PURPOSE:To improve the exfoliation of a region not formed with a conductor film of a second resist film by forming an opening formed with a dummy conductor film on a region not formed with the conductor film in a first resist film disposed on a substrate and a second resist film formed on a conductor film forming region, and invading an exfoliation solution on the second film through the opening. CONSTITUTION:A first resist film 18 is formed on a passivation film 4I of a region not formed with a salient-electrode (conductor film) 8 of a mother chip 4. Then, a second resist film 19 is formed on a whole substrate including the film 4I and the film 18. Thereafter, a first opening 20A is formed at a part formed with the electrode 8 of the film 19 (on an inner terminal P1), and a second opening 20B for forming a dummy salient-electrode 8A is formed on a region not formed with the electrode 8. The electrode 8 is formed on a barrier metal layer 4K on wirings 4G of the inner terminal P1 in the opening 20A of the film 19. An exfoliation solution is impregnated to the film 19 through the opening 20B. Then, the films 19, 18 are removed. Since the film 18 can be removed in the step of removing the film 19, manufacturing steps can be shortened. |
