发明名称 AUTOMATIC ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PURPOSE:To contrive to improve the productivity on a multi-type product and small-lot production basis by a method wherein electronic components are taken out from component feeding units in every step of data on mounting and an operation concerned in mounting based on data on component layout stored in common without depending upon the kind of a printed board is made to take place. CONSTITUTION:A storage part, which stores data on component layout for storing the types of components, which are fed by component feeding units 8 in every array position, in common without dependending upon the kind of a printed board 6, is provided and a storage part, which stores data on component type for storing data on an operation concerned in mounting of the component in every component type, is provided. Then, electronic components are taken out from the units 8 to be taken out components in every step of data on mounting in a storage part and an operation concerned in mounting based on the data on component type in the storage part for the component type shown by the data on component layout in the layout storage part is made to take place and the electronic components are mounted on the board 6.
申请公布号 JPH07131186(A) 申请公布日期 1995.05.19
申请号 JP19930278704 申请日期 1993.11.08
申请人 SANYO ELECTRIC CO LTD 发明人 OYAMA KAZUYOSHI
分类号 B23P21/00;H05K13/00;H05K13/04 主分类号 B23P21/00
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