CERAMIC PACKAGE FOR INTEGRATED CIRCUIT

摘要

PURPOSE:To provide a glass seal type package with which the wire bonding of an integrated circuit that is provided with fine pitched pads is possible without the limit by the pitches of metal leads on the inner end side. CONSTITUTION:Connection paths 4 that connects electrically pads 8 of an integrated circuit 7 with metal leads 9 for external connection inside a glass layer 3a of a peripheral surface 3 of the package 1 are provided. With connection paths 4, the pitches P2 at the outer end parts 6 are the same as the pitches of the metal leads 9 at the inner end parts 10 and the pitches P1 at the inner end parts 5 are small and the same as the pitches P1 of the pads 8 of the integrated circuit 7.