High current hermetic package

摘要

A package for a device comprises a header having a substantially flat upper surface. An insulating disk is affixed to the upper surface of the header for having the device mounted thereon. A barrel having upper and lower portions of respectively greater and smaller diameters, and having a step between the diameters, has a lower edge thereof attached to the upper surface of the header so as to surround the disk. A ceramic lid in the upper portion of the barrel abuts the step is attached thereat.