Electrical interconnection having angular lead design

摘要

An electrical interconnection is provided for electrically and physically connecting a plurality of bonding sites (14) on an integrated circuit chip (10) to a plurality of external electrical connections. The electrical interconnection contains a plurality of individual electrical leads (16) which have been formed so as to have the same degree of non-perpendicularity with respect to the rectangular shape of the integrated circuit (10). All of the individual leads (16) are angled so as to rotate in the same direction around the integrated circuit (10). This angled lead design provides enhanced strain relief and improved performance during use since the integrated circuit (10) is free to rotate under an applied stress, whilst efficiently maximizing the number of available electrical leads (16) for bonding to the integrated circuit chip (10). In addition, this electrical interconnection is suitable for use with tape automated bonding methods.