| 摘要 |
PURPOSE:To rapidly, simply and correctly perform heat resistance evaluation by mounting a substrate such as a silicon wafer on a substrate supply part and setting a resist liquid such as a photoresist and an electronic wire resist in a resist application part. CONSTITUTION:The title device is provided with a substrate supply part 106 changing and supplying this substrate 104, a resist application part 108 applying a resist liquid to the substrate 104, a drying part 115 drying the resist liquid, an exposure part 110 exposing the dried resist to a prescribed pattern, a developing part 112 developing the resist and a heat resistance evaluation part 114 irradiating coherent light on the resist and measuring the intensity of diffraction light excepting O-degree thereof to evaluate its heat resistance by a shape change of the resist. Thereby, only setting a silicon wafer 104 and the resist liquid allows heat resistance evaluation of the resist having the prescribed resist pattern to be made rapidly, simply, correctly and quantitatively. |
