Naked component COB hermetic sealing method for DRAM of personal computer - connecting and pre-hardening covered component at temperature of 65 degrees C and filling bonding wire bridges before complete hermetic sealing

摘要

The method involves forming an outer ring (2) in the form of a bead around the component to be sealed (5). The hermetic material of the outer geometry of the component and bond wiring then becomes fixed on a circuit board (1). The covered component is then connected and pre-hardened at a temperature of around 65[deg]C. After the pre-hardening, the bonding wire bridges become filled after which a complete hermetic sealing of the component with the complete covering of the bonding wires is carried out.