摘要 |
The present invention relates to a capacitive micro-sensor comprising a sandwich of three silicon wafers (1, 2, 3), a peripheral strip of each surface of the central wafer being applied to a corresponding strip of the facing surface of an external wafer by way of an insulating strip (5, 6), characterised in that the lateral surfaces of the said sandwich are notched near the outcrop of each of the said insulating strips. <IMAGE> |
申请人 |
SEXTANT AVIONIQUE S.A., MEUDON LA FORET, FR |
发明人 |
THOMAS, ISABELLE, F-26000 VALENCE, FR;LEFORT, PIERRE-OLIVIER, F-26000 VALENCE, FR;LEGOUX, CHRISTOPHE, F-26000 VALENCE, FR |