| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip carrier excellent in reliability on connection, where breakage, wire breaking, etc., caused by the difference in thermal expansion coefficient between an LSI chip and a chip carrier and a mother board do not occur and a semiconductor device using it, in a semiconductor device used for each kind of electronic equipment. SOLUTION: For this chip carrier, a circular member 106 consisting of material larger in thermal expansion coefficient than a carrier board 108 is provided at the periphery of the said carrier board 108 which has such construction that a first connection pad 102 and a second connection pad 105 made on both sides of a flexible insulating board 101 where aramid fibers are used as reinforcing material are electrically connected with each other through a via hole 103 opened in the said insulating board 110. An LSI chip 201 is mounted in the recess of this chip carrier.
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