| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor lead forming device which can reduce the occurrence of defective products as much as possible and, at the same time, can improve the productivity. SOLUTION: A semiconductor lead forming device is provided with a forming base 1 on which a semiconductor device 7 from which a lead 9 carrying attached solder is led out and a forming base punch 3 which forms the lead 9 to a prescribed shape by pressing the led 9 against the base 1. Since a groove 5 is provided in the area on the base 1 in which the lead 9 is moved on the base 1 while the lead 9 is in contact with the base 1 so that the solder which comes off the lead 9 cannot be dragged on the base 1 at the part of the groove 5 when the front end of the lead 9 is moved on the base 1 in a state where the front end is in contact with the base, the deposition of the solder on the base, particularly, at or near the bent section of the lead 9 can be prevented.</p> |
