| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and apparatus for soldering electronic components, suited for soldering a directly bonded Cu board to a metal base. SOLUTION: A capillary diffusion type soldering zone 6 is disposed between a main chamber 7 held in a reductive and low-O concn. atmosphere inside and branch chamber 8 held in a reductive atmosphere inside. This chamber 8 is coupled just in the front of the soldering zone. The main chamber 7 has a base conveyer 7a for carrying a metal base 3 with its soldering surface up and preheating and cooling means disposed separately in an inlet, soldering zone and outlet. The branch chamber 8 has a board conveyer 8a for carrying a ceramic board 1 in this chamber 8 with the soldering surface down and overlaying it on the base 3 in the main chamber 7, and preheating means for preheating the board 1 and the base 3 being exposed to the reductive atmosphere during carrying, overlaying it on the base 3 just before the soldering zone to solder them.</p> |
