发明名称 EASILY UNSEALABLE ETHYLENIC RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an easily unsealable ethylenic resin compsn. which has excellent balance between easy unsealing and rigidity while maintaining heat seal strength necessary as a packaging material. SOLUTION: This easily unsealable ethylenic resin compsn. comprises 100 pts.wt. of the ethylenic resin, with an ethylene/α-olefin copolymer content of at least 50 wt.%, having a density of 0.860 to 0.940 g/cm<3> and a melt flow rate (ASTM 1238, 190 deg.C, load 2.16 kg) of 0.5 to 50 g/10 min, and 0.5 to 70 pts.wt. of a 4-methyl-1-pentene polymer, wherein the tensile modulus of elasticity of a film formed from the compsn. is 500 to 3,600 kgf/cm<2> and the heat seal strength is 0.2 to 1.6 kg/15 mm as measured by a method wherein laminates prepd. by laminating the compsn. as a sealant layer directly or through a polyethylene resin onto a laminate substrate are heat sealed at temperatures of 120 to 200 deg.C so that sealant layers of the laminates face each other. This compsn. can be formed into films and bags as a packaging material for foods and the like, and can realize hygienic packaging. Further, the cutting can be easily made by pulling with a weak force in right and left directions.
申请公布号 JPH11152375(A) 申请公布日期 1999.06.08
申请号 JP19970321184 申请日期 1997.11.21
申请人 MITSUI CHEM INC 发明人 SOMA YOSHIKUNI
分类号 B32B27/32;C08F4/642;C08L23/04;(IPC1-7):C08L23/04 主分类号 B32B27/32
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