Elastische Schaltplatinenanordnung mit gemeinsamer Wärmeabfuhr sowie Herstellungsverfahren hierfür,申请号DE1994606854-传众专利搜索

发明名称	Elastische Schaltplatinenanordnung mit gemeinsamer Wärmeabfuhr sowie Herstellungsverfahren hierfür
摘要	Disclosed are multi-layer substrates for flexible circuit boards and flexible circuit board assemblies and their methods of manufacture. More particularly multi-layer flexible circuit board substrates are described for attaching components including chips and heat spreaders to form a three-dimensional circuit board assembly. <IMAGE>
申请公布号	DE69406854(D1)	申请公布日期	1998.01.02
申请号	DE1994606854	申请日期	1994.06.01
申请人	INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US	发明人	CUTTING, LAWRENCE RICHARD, OWEGO, NEW YORK 13827, US;GAYNES, MICHAEL ANTHONY, VESTAL, NEW YORK 13850, US;JOHNSON, ERIC ARTHUR, GREENE, NEW YORK 13778, US;MILKOVICH, CYNTHIA SUSAN, VESTAL, NEW YORK 13850, US;PERKINS, JEFFREY SCOTT, ENDWELL, NEW YORK 13760, US;PIERSON, MARK VINCENT, BINGHAMTON, NEW YORK 13901, US;POETZINGER, STEVEN EUGENE, ENDICOTT, NEW YORK 13760, US;ZALESINSKI, JERZY, ESSEX JUNCTION, VERMONT 05452, US
分类号	H01L21/48;H01L23/367;H01L23/538;H05K1/00;H05K1/02;H05K1/18;H05K3/00;H05K3/12;H05K3/34;H05K7/20;(IPC1-7):H05K7/20	主分类号	H01L21/48
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