发明名称 CURABLE RESIN COMPOSITION AND ADHESIVE
摘要 PROBLEM TO BE SOLVED: To obtain a composition having high shelf stability with time, not hampering adhesiveness, useful as an adhesive. SOLUTION: This curable resin composition comprises (A) a curable resin and (B) a ketimine structure-containing organosilicon compound obtained by reacting an amino group-containing organosilicon compound of formula I (R1 is a 1-4C monofunctional hydrocarbon group; R2 is a 1-10C bifunctional hydrocarbon group; (n) is 1, 2 or 3; R3 and R4 are each a hydrogen atom or a 1-10C monofunctional hydrocarbon group, R3 and R4 are not a hydrogen atom at the same time and R3 and R4 may form a cyclic structure with the carbon atom of a carbonyl group) with a monocarbonyl compound of formula II. A ketimine structure-containing organosilicon compound having 50-95% monomer purity and >=90% amino group blocking ratio is used as the ketimine structure- containing organosilicon compound.
申请公布号 JP2000044817(A) 申请公布日期 2000.02.15
申请号 JP19980229327 申请日期 1998.07.30
申请人 SHIN ETSU CHEM CO LTD 发明人 YANAGISAWA HIDEYOSHI;YAMATANI MASAAKI
分类号 C08K5/29;C08G18/28;C08G59/40;C08L63/00;C08L75/00;C08L75/04;C08L101/00;C09J163/00;C09J175/00;C09J175/04;C09J201/00;(IPC1-7):C08L101/00 主分类号 C08K5/29
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