发明名称 EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin not forming a hydroxy group by the curing reaction of the phenol compound with an epoxy group and giving a cured product having an excellent electric insulation characteristic, etc., by compounding an epoxy resin and a phenol compound phosphinic acid ester. SOLUTION: This epoxy resin composition contains (A) an epoxy resin and (B) a phenol compound phosphinic acid ester, preferably a bisphenol compound bisphosphinic acid ester of the formula: [R1 is a bisphenol compound bond (group); R2 and R3 are each an alkyl, an aryl, an aralkyl or the like, provided that one of R2 and R3 may be H]. The epoxy resin composition may preferably further contain (C) a quaternary onium salt catalyst such as tetrabutylammonium bromide, (D) a crown ether catalyst such as 12-crown-4 or (E) a tertiary amine salt catalyst or a tertiary phosphinic acid catalyst such as 1,8- diazabicylo[5.4.0]-7-undecene.
申请公布号 JP2000044652(A) 申请公布日期 2000.02.15
申请号 JP19980227707 申请日期 1998.07.28
申请人 UNIV KANAGAWA 发明人 NISHIKUBO TATATOMI;KAMEYAMA ATSUSHI
分类号 C08L63/00;C08G59/40;C08G59/68;(IPC1-7):C08G59/40 主分类号 C08L63/00
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