HEAT-CONDUCTIVE RESIN COMPOSITION, PREPREG, RADIATING CIRCUIT BOARD AND RADIATING HEATING PART

摘要

PROBLEM TO BE SOLVED: To provide a heat-conductive resin composition which can obtain a molded product highly filled with an inorganic filler and having excellent thermal conductivity and can be suitably used in forming an insulating layer of a radiating circuit board and in forming an adhesive layer for fixing a metallic radiating element to a heating part. SOLUTION: An inorganic filler having 30-60 pts.mass particles having an average particle diameter of 50-100μm, 30-60 pts.mass particles having an average particle diameter of 5-30μm, and 5-10 pts.mass particles having an average particle diameter of 0.1-3μm is used. The inorganic filler is incorporated in an amount of 80-95 wt.% to render the thermal conductivity 3-10 W/mK.