| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to suppress generation of pin holes and wire breaking occurring on a surface of cured liquid resin by maintaining a temperature where liquid resin is thermally cured after maintaining a temperature where viscosity of the liquid resin suddenly decreases. SOLUTION: When a bare chip IC mounted on a substrate is sealed and cured by liquid resin containing a thermal cure epoxy-resin compound, after being maintained in a temperature where viscosity of liquid resin suddenly decreases the IC is maintained in a temperature which liquid resin is thermally cured. For example it is maintained in a temperature T1 deg.C where viscosity of the liquid resin suddenly decreases for constant A1 minutes, after that it is maintained in a lower temperature T2 deg.C than TE deg.C where thermal cure of the liquid resin practically occurs for a constant time A2 minutes to sufficiently cure. After that step heating is gradually performed by the temperate TE deg.C, the temperature TE deg.C is maintained for constant A3 minutes to thermally cure. In the next step of cooling to normal temperature aneal of T3 deg.C during constant A4 minutes and T4 deg.C for a constant A5 minutes is performed by being separated at TG deg.C which is a border of glass transfer temperature of the substrate.</p> |
