发明名称
摘要 <p>A silicon nitride layer 12b is thermally grown on the topmost surface of the heat treatment jig 12 composed of silicon or silicon carbide in a nitrogen ambience. The silicon nitride layer 12b is thermally grown in a nitrogen ambience in the temperature range of 1,100 DEG C-1,300 DEG C. It is desirable to remove slightly the surface of the jig by, for example, hydrogen etching before thermally growing the silicon nitride layer 12b. After the etching, a silicon oxide layer can be thermally grown on the jig surface in an oxygen ambience before thermally growing the silicon nitride layer 12b. <IMAGE></p>
申请公布号 JP3285723(B2) 申请公布日期 2002.05.27
申请号 JP19940308243 申请日期 1994.11.17
申请人 发明人
分类号 H01L21/22;H01L21/31;H01L21/673;(IPC1-7):H01L21/68 主分类号 H01L21/22
代理机构 代理人
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