| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer cleaner which attains uniform cleaning over the entire surface of a large-diameter wafer. SOLUTION: The wafer cleaner has means 7, 8 for revolving a semiconductor wafer in a plane, and cleaning nozzles 1a, 1b, 1c for jetting a cleaning liquid on the backside of the revolving wafer. The nozzles 1a, 1b, 1c comprise a plurality of jet holes 2a, 2b, 2c directed toward different regions on the wafer backside Wb, so that the liquid arrives at the backside without mutually contacting jets of the cleaning liquid. and controllers for controlling the jet pressure and the jet flow rate of the cleaning liquid independently every jet hole. The jet holes 2a, 2b, 2c are disposed in the directions corresponding to the revolving direction of the wafer. The controller controls the jet pressure of the cleaning liquid every jet hole so that the arrival speed of the liquid jetted from each jet hole at the wafer backside is approximately equal to a wafer revolving speed on a target region of each jet hole. A gas blow nozzle 3 is provided for temporarily jetting a gas on the revolving wafer backside.
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