METHOD OF MAKING LED ENCAPSULANT WITH UNDULATING SURFACE

摘要

An LED package includes an LED die and a light-transmissive material encapsulating the die. The encapsulant is formed by dispensing a curable material onto a substrate, such as a carrier on which is mounted the LED die, to form a liquid mass thereon, the liquid mass having an unconstrained smooth outer surface. The dispensed material is then cured to convert the liquid mass to a solid encapsulant having an outer encapsulant surface, the curing being performed under conditions to provide the outer encapsulant surface with undulating surface features. The encapsulant can alternatively be formed on a release liner or other film and after curing be affixed to an LED, such as an LED die, an LED die mounted to another substrate, or an LED die mounted to another substrate and encapsulated initially in another light transmissive material.